Publications (FIS)

Novel Glass-Silicon Emitter Chip for Field Emission Applications

authored by: Aleksandra M. Buchta, Alexander Kassner, Julia Voß, Tobias Leopold, Julian Petring, Leonard Diekmann, Folke Dencker, Marc C. Wurz
Abstract: This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.
Organisation(s): Institute of Microtechnology
Quantum Technologies
QUEST-Leibniz Research School
Type: Conference contribution
Pages: 207-209
No. of pages: 3
Publication date: 27.07.2023
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electronic, Optical and Magnetic Materials, Instrumentation, Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.1109/ivnc57695.2023.10188880 (Access: Closed)

BibTeX

@inproceedings{9a5b51f77b92469993904cc8b7cc59b3,
title = "Novel Glass-Silicon Emitter Chip for Field Emission Applications",
abstract = "This work presents the design and fabrication of a novel emitter chip comprising a silicon electron source with pyramidal structures and a glass extraction electrode. The emitters were fabricated using a wafer dicing technique. The glass extraction electrode was manufactured by Laser Induced Deep Etching (LIDE), metallized, and bonded onto the silicon chip using laser-assisted bonding. Current-voltage experiments confirm the excellent performance of the diced emitters, highlighting their potential for a wide range of applications.",
keywords = "FEA, LIDE, dicing field emitters, glass extraction electrode, silicon field emitters",
author = "Buchta, {Aleksandra M.} and Alexander Kassner and Julia Vo{\ss} and Tobias Leopold and Julian Petring and Leonard Diekmann and Folke Dencker and Wurz, {Marc C.}",
note = "Funding Information: This work has been carried out as a part of the joint project {"}Innovative Vacuum Technology for Quantum Sensors{"} (InnoVaQ) funded by the German Federal Ministry of Education and Research (BMBF) as part of the funding program {"}Quantum Technologies – from basic research to market{"}. (Contract number: 13N15919).",
year = "2023",
month = jul,
day = "27",
doi = "10.1109/ivnc57695.2023.10188880",
language = "English",
isbn = "979-8-3503-0144-1",
series = " International Vacuum Nanoelectronics Conference",
publisher = "IEEE",
pages = "207--209",
booktitle = "2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC)",
}